BENCHMARK ELECTRONICS, INC.
Tempe, Arizona (AZ), United States
Aerospace, Defense & Security
Products & Services
ADVANCED COMPUTING
Benchmark Electronics, Inc.
In the quest for superior high-performance computing, data speeds have reached the limitations of existing technology, requiring new systems that leverage photonics and high-speed circuits to make gains. As data storage needs grow exponentially, data center architectures and technologies need to evolve equally rapidly. Benchmark combines engineering and manufacturing expertise with a focus on emerging technology to provide solutions, pushing the boundaries of what’s possible alongside innovators like you to develop cutting-edge computing technologies of the future.
FROM DESIGN TO FULL-SCALE PRODUCTION
Benchmark is an engineering and manufacturing partner for multiple systems on the Top 500 list. We bring our diverse portfolio of expertise with challenging technologies and unique capabilities to offer unparalleled support for all of your high-performance computing needs. We've invested in fiber optics and photonics test, assembly, and packaging capabilities to give you the advanced manufacturing processes necessary to make designs a reality.
FLEXIBILITY WHEN YOU NEED IT
As a trusted partner, we understand your need for flexibility as you develop competitively differentiated computing solutions. Benchmark can work with you to launch at initial production rate volumes for promising technologies and scale production at the rate of your success. Because we can work with you from concept to market, we can meet short product development cycles, diagnose and remedy manufacturing issues, and optimize complex mixed-technology systems. We also have the flexibility to work alongside our partners in joint development manufacturing efforts, engaging as little or as much as you need to ensure the success of your computing program.
FROM DESIGN TO FULL-SCALE PRODUCTION
Benchmark is an engineering and manufacturing partner for multiple systems on the Top 500 list. We bring our diverse portfolio of expertise with challenging technologies and unique capabilities to offer unparalleled support for all of your high-performance computing needs. We've invested in fiber optics and photonics test, assembly, and packaging capabilities to give you the advanced manufacturing processes necessary to make designs a reality.
FLEXIBILITY WHEN YOU NEED IT
As a trusted partner, we understand your need for flexibility as you develop competitively differentiated computing solutions. Benchmark can work with you to launch at initial production rate volumes for promising technologies and scale production at the rate of your success. Because we can work with you from concept to market, we can meet short product development cycles, diagnose and remedy manufacturing issues, and optimize complex mixed-technology systems. We also have the flexibility to work alongside our partners in joint development manufacturing efforts, engaging as little or as much as you need to ensure the success of your computing program.
MICROELECTRONICS
Benchmark Electronics, Inc.
MIXED AND HYBRID TECHNOLOGY MODULES AND ASSEMBLIES
Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.
Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.
ADVANCED CAPABILITIES
Microelectronics assembly, automation, and test engineering services from one provider
Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
Broad microelectronics bonding and attachment capabilities
Customized automated processing for high production volumes
Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
Precision optical alignment
Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.
Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.
ADVANCED CAPABILITIES
Microelectronics assembly, automation, and test engineering services from one provider
Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
Broad microelectronics bonding and attachment capabilities
Customized automated processing for high production volumes
Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
Precision optical alignment
About
Benchmark is a worldwide provider of innovative product design, engineering services, technology solutions and advanced manufacturing services. From initial product concept to volume production, including direct order fulfillment and aftermarket services, Benchmark has been providing integrated services and solutions to original equipment manufacturers since 1979. Today, Benchmark proudly serves the following industries: aerospace, defense, medical technologies, complex industrials, semiconductor capital equipment, next-generation telecommunications, and high-performance computing. Benchmark’s global operations network includes facilities in eight countries and common shares trade on the New York Stock Exchange under the symbol BHE.
The Benchmark team consists of ~11,000 employees in 22 worldwide locations and is headquartered in Tempe, Arizona.
The Benchmark team consists of ~11,000 employees in 22 worldwide locations and is headquartered in Tempe, Arizona.
