MICROELECTRONICS
MIXED AND HYBRID TECHNOLOGY MODULES AND ASSEMBLIES
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Description
MIXED AND HYBRID TECHNOLOGY MODULES AND ASSEMBLIES
Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.
Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.
ADVANCED CAPABILITIES
Microelectronics assembly, automation, and test engineering services from one provider
Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
Broad microelectronics bonding and attachment capabilities
Customized automated processing for high production volumes
Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
Precision optical alignment
Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.
Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.
ADVANCED CAPABILITIES
Microelectronics assembly, automation, and test engineering services from one provider
Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
Broad microelectronics bonding and attachment capabilities
Customized automated processing for high production volumes
Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
Precision optical alignment
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